4001 Hardware Characteristics

Absolute Maximum Ratings

Ambient Temperature Under Bias

0 o C to +70 o C

Storage Temperature

-55 o C to +125 o C

Input Voltage and Supply Voltage
with respect to V SS

+0.5 to -20 V

Power Dissipation

1.0 W

Note that stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

D.C. and Operating Characteristics

\(T_{A}\) = \(0^{o}\) C to \(70^{o}\) C

\(V_{SS}\) - \(D_{DD}\) = 15V ± 5%

\(t_{\phi PW}\) = \(t_{\phi D1}\) = 400nsec

logic “0” is defined as the more positive voltage (\(V_{IH}\), \(V_{OH}\))

logic “1” is defined as the more negative voltage (\(V_{IL}\), \(V_{OL}\)); unless otherwise specified.

SUPPLY Current

Symbol

Parameter

Min

Limit Typical

Max

Unit

Test Conditions

\(I_{DD}\)

Average Supply Current

15

30

mA

\(T_{A}\) = \(25^{o}\) C

Input Characteristics

\(I_{LI}\)

Input Leakage Current

10

\({\mu}A\)

\(V_{IL}\) - \(V_{DD}\)

\(V_{IH}\)

Input High Voltage (except clocks)

\(V_{SS}\) -1.5

\(V_{SS}\) +0.3

V

\(V_{IL}\)

Input Low Voltage (except clocks)

\(V_{DD}\)

\(V_{SS}\) -5.5

V

\(V_{IHC}\)

Input High Voltage Clocks

\(V_{SS}\) -1.5

\(V_{SS}\) +0.3

V

\(V_{ILC}\)

Input Low Voltage Clocks

\(V_{DD}\)

\(V_{SS}\) -13.4

V

Output Characteristics - All outputs except I/O Pins

\(I_{LO}\)

Data Bus Output Leakage Current

10

\({\mu}A\)

\(V_{OUT}\) = -12V

\(V_{OH}\)

Output High Voltage

\(V_{SS}\)-0.5V

\(V_{SS}\)

V

Capacitance Load

\(I_{OL}\)

Data Lines Sinking Current

8

15

mA

\(V_{OUT}\) = \(V_{SS}\)

\(V_{OL}\)

Output Low Voltage, Data Bus, CM, Sync

\(V_{SS}\)-12

\(V_{SS}\)-6.5

V

\(I_{OL}\) = 0.5mA

\(R_{OH}\)

Output Resistance, Data Line 0 Level

150

250

\({\Omega}\)

\(V_{OUT}\) = \(V_{SS}\) - 0.5V

I/O Input Characteristics

\(I_{LI}\)

Input Leakage Current

10

\({\mu}A\)

\(V_{IH}\)

Input High Voltage

\(V_{SS}\) -1.5V |

\(V_{SS}\) +0.3

V

\(I_{IL}\)

Input Low Voltage, Inverting Input

\(V_{DD}\)

\(V_{SS}\) -4.2

V

\(V_{IL}\)

Input Low Voltage, Non-Inverting Input

\(V_{DD}\)

\(V_{SS}\) -6.5

V

\(V_{IL}\)

CL Low Voltage

\(V_{DD}\)

\(V_{SS}\) -4.2

V

\(R_{I}\)

Input Resistance, if used

10

18

35

\(k{\Omega}\)

\(R_{1}\) tied to \(V_{SS}\) ; \(V_{IN}\) - \(V_{SS}\) - 0.3V

\(R_{1}\) [1]

Input Resistance, if used

15

25

40

\(k{\Omega}\)

\(R_{1}\) tied to \(V_{DD}\) ; \(V_{IN}\) - \(V_{SS}\) - 0.3V

I/O Output Characteristics

\(V_{OH}\)

Output High Voltage

\(V_{SS}\) -1.5V

V

\(I_{OUT}\) = 0

\(R_{OH}\)

I/O Output “0” Resistance

1.2

2

\(k{\Omega}\)

\(V_{OUT}\) - \(V_{SS}\) - 0.5V

\(I_{OL}\)

I/O Output “1” Sink current

2.5

5

\({\mu}A\)

\(V_{OUT}\) - \(V_{SS}\) - 0.5V

\(I_{OL}\) [2]

I/O Output “1” Sink current

0.8

3

\({\mu}A\)

\(V_{OUT}\) - \(V_{SS}\) - 4.85V

\(V_{OL}\)

I/O Output Low Voltage

\(V_{DD}\) -12

\(V_{SS}\) -6.5

V

\(I_{OUT}\) = \(50{\mu}A\)

Capacitance

\(C_{\phi}\)

Clock Capacitance

8

15

pF

\(V_{IN}\) - \(V_{SS}\)

\(C_{DB}\)

Data Bus Capacitance

9.5

15

pF

\(V_{IN}\) - \(V_{SS}\)

\(C_{IN}\)

Input Capacitance

10

pF

\(V_{IN}\) - \(V_{SS}\)

\(C_{OUT}\)

Output Capacitance

10

pF

\(V_{IN}\) - \(V_{SS}\)

Note

[1] \(R_{1}\) is large signal equivalent resistance to \((V_{SS} - 4.85)\) V

[2] For Transistor-transistor logic (TTL) compatibility, use \(12 k{\Omega}\) external resistor to \(V_{DD}\)

Typical D.C. Characteristics

../../_images/4001-dc-characteristics.png

A.C. Characteristics

\(T_{A}\) = \(0^{o}\) C to \(70^{o}\) C

\(V_{SS}\) - \(D_{DD}\) = 15V ± 5%

Symbol

Parameter

Min

Limit Typical

Max

Unit

Test Conditions

\(t_{CY}\)

Clock Period

1.35

2.0

\({\mu}sec\)

\(t_{\phi R}\)

Clock Rise Times

50

ns

\(t_{\phi F}\)

Clock Fall Times

50

ns

\(t_{\phi PW}\)

Clock Width

380

480

ns

\(t_{\phi D1}\)

Clock Delay \(t_{\phi 1}\) to \(t_{\phi 2}\)

400

550

ns

\(t_{\phi D2}\)

Clock Delay \(t_{\phi 2}\) to \(t_{\phi 1}\)

150

ns

\(t_{W}\)

Data-In, CM, SYNC Write Time

350

100

ns

\(t_{H}\) [1,3]

Data-In, CM, SYNC Hold Time

40

20

ns

\(t_{OS}\) [2]

Set Time (Reference)

0

ns

\(t_{ACC}\)

Data-Out Access Time
Data Lines
SYNC
CM-ROM
CM-RAM


930
930
930
930

ns



\(C_{OUT}\) =
500pF Data Lines
500pF SYNC
160pF CM-ROM
50pF CM-RAM

\(t_{OH}\)

Data-Out Hold Time

50

150

ns

\(C_{OUT}\) = 20pF

\(t_{IS}\)

I/O Input Set-Time

50

ns

\(t_{IH}\)

I/O Input Hold-Time

100

ns

\(t_{D}\)

I/O Output Delay

1500

ns

\(C_{OUT}\) = 100pF

\(t_{D}\) [4]

I/O Output Lines Delay on Clear

1500

ns

\(C_{OUT}\) = 100pF

Note

[1] \(t_{H}\) measured with \(t_{\phi R}\) = 10nsec

[2] \(T_{ACC}\) is Data Bus, SYNC and CM-line output access time referred to the \({\phi}_{2}\) trailing edge which clocks these lines out. \(t_{OS}\) is the same output access time referred to the leading edge of the next \({\phi}_{2}\) clock pulse.

[3] All MCS-40 components which may transmit instruction or data to the 4004 at \(M_{2}\) and \(X_{2}\) always enter a float state until the 4004 takes over the data bus at \(X_{1}\) and \(X_{3}\) time. Therefore, the \(T_{H}\) requirement is always insured since each component contributes \(10{\mu}A\) of leakage current and 10pF of capacitance, which guarantees that the data bus cannot change faster than \(1V/{\mu}sec\)

[4] CL on the 4001 is used to asynchronously clear the input flip-flops associated with the I/O lines.

4001 Timing Diagram

../../_images/4001-timing-diag.png

4001 Timing Diagram Detail

../../_images/4001-timing-diag-detail.png